Wolfspeed launches 200mm SiC materials portfolio
Wolfspeed has announced the commercial launch of its 200mm SiC materials products, marking a milestone in the company’s mission to accelerate the industry’s transition from silicon to SiC.
It is also offering 200mm SiC epitaxy for immediate qualification, which, when paired with the company’s 200mm bare wafers, will deliver breakthrough scalability and improved quality, enabling the next generation of high-performance power devices, according to the company.
“Wolfspeed’s 200mm SiC wafers are more than an expansion of wafer diameter – it represents a materials innovation that empowers our customers to accelerate their device roadmaps with confidence,” said Cengiz Balkas, chief business officer.
The company says that the improved parametric specifications of the 200mm SiC bare wafers at 350µm thickness and enhanced doping and thickness uniformity of the 200mm epitaxy enables device makers to improve MOSFET yields, accelerate time-to-market, and deliver more competitive solutions across automotive, renewable energy, industrial, and other high-growth applications.
“This advancement reflects Wolfspeed’s long-standing commitment to pushing the boundaries of SiC materials technology,” said Balkas. “This launch demonstrates our ability to anticipate customer needs, scale with demand, and deliver the materials foundation that makes the future of more efficient power conversion possible.”
