Mitsubishi to ship compact DIPIPM modules
Mitsubishi Electric has developed a new compact version of its DIPIPM power semiconductor modules specifically for use in consumer and industrial equipment such as packaged air conditioners and heat pump heating and hot water systems.
The new Compact DIPIPM series of products comprises the PSS30SF1F6 (rated current 30A / rated voltage 600V) and the PSS50SF1F6 (rated current 50A / rated voltage 600V), and samples will begin shipping on September 22 2025.
By using reverse-conducting IGBTs, the module’s footprint has been reduced to almost 53 percent of that of the company’s conventional Mini DIPIPM Ver.7 series of products, enabling more compact inverter substrates in packaged air conditioners and other applications. The insulation distance from the terminals to the heat sink is equivalent to that of conventional products, making replacement easy.
In addition, in response to the growing demand for heat pump air conditioning systems in regions with cold winters such as North America and Northern Europe, Mitsubishi Electric has announced developing a power semiconductor module that operates stably at low temperatures, achieving a continuous operating temperature lower limit of -40°C.
The new products will be exhibited at Power Conversion and Intelligent Motion (PCIM) Asia Shanghai 2025 in Shanghai, China, from September 24 to 26 2025.
