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AI data crucial to shaping an agile, robust supply chain strategy
Ankur Gupta, Senior Director of Product Management for Model N High Tech products, discusses why supply chain disruptions and uncertainties are the top factors impacting revenue management strategy this year within the semiconductor sector. He explains how manufacturers must maintain control and agility to navigate this volatile landscape, with the focus being on prioritising supply chain transparency, reimagining contract structures, developing contingency-based pricing models and, above all, ensuring access to high quality data (and the subsequent analytics) to help shape a successful supply chain strategy.

STILE technology strengthens US semiconductor packaging advancements
Ron Huemoeller, CEO of Saras Micro Devices is bringing its expertise in power delivery solutions to two high-impact semiconductor research projects, each awarded $100 million under the U.S. Department of Commerce CHIPS National Advanced Packaging Manufacturing Program (NAPMP). By integrating its STILE™ technology, Saras is helping drive advancements in power efficiency and chiplet integration for high-performance computing (HPC) and AI applications.

Terecircuits shares material science innovations for advanced packaging applications
Wayne Rickard, Terecircuits CEO, outlines the company’s decision to join the US’s National Semiconductor Technology Center, contributing its considerable expertise in the synthesis, characterization and delivery of polymers, encapsulants and thin film coatings for advanced packaging. Wayne explains that, in working alongside industry leaders across the U.S. semiconductor ecosystem, Terecircuits can accelerate the development of advanced material solutions for heterogeneous integration and, in so doing, is helping to tackle critical challenges in high-density, high-performance chip manufacturing.

NIL and MEMS - a powerful combination
Thomas Achleitner, Business Development Manager at EV Group, gives us a preview of the paper he is presenting at the forthcoming AngelTech event: ‘Leveraging NIL for µLED Lens Packaging’, explaining why NIL is particularly suited for this application, and other process steps that NIL could cover. He also explains about the company’s NIL Photonic Competence Center and talks through the recently launched next-generation version of its GEMINI automated production wafer bonding system for 300-mm wafers.

Revolutionising semiconductor design
Andy Nightingale, Vice President Product Management & Marketing at Arteris, discusses exciting developments at the company: the launch of FlexGen, smart network-on-chip IP accelerating chip design by up to 10x, enhancing engineering efficiency by 3x and with AI-driven heuristics reducing wire length by up to 30% the immediate availability of the latest generation of Magillem Registers technology for SoC integration automation, featuring significant advancements to performance, capacity, standards support, and usability and the news that Nextchip has licensed Arteris’ FlexNoC 5 interconnect IP with Functional Safety for its EFREET1 project for automotive vision.

Streamlining electronics system development
Ted Pawela, VP, Head of Customer Success at Renesas, introduces the Renesas 365, Powered by Altium, platform, which promises to revolutionise embedded system development - too often restricted by manual component searches, fragmented documentation and siloed teams. Ted explains how Renesas 365 integrates hardware, software, and lifecycle data into a single digital environment, to streamline workflows, accelerate time to market, ensure digital traceability and real-time insights, and improve decision-making from concept to deployment.

New SMU helps semiconductor device development
Edwin Luijks, Product Manager at Yokogawa Test&Measurement, talks through the company’s new AQ2300 series high-performance, modular, high-speed SMU (Source Measure Unit) offering high-quality pulse generation alongside high-precision voltage/current generation and measurements. Thanks to its inherent productivity and expandability characteristics, the 2-channel SMU module also saves time and space when performing the typically complex measurement functions essential for semiconductor devices.

China, geopolitics and the global semiconductor industry
Doug Sparks, CEO of M2N Technologies LLC, a consulting firm specializing in semiconductors, MEMS and sensors, including their supply chains, discusses geopolitics and supply chains, with particular reference to China, AI, sustainability and skills – sharing his considerable knowledge and experience of the global semiconductor industry. Doug has recently published a book on his ‘specialist subject’: ‘A Decade In The Chinese Semiconductor Industry: An American’s Story, which provides insight into the semiconductor and MEMS industry in China – technology, growth, historical background, IP protection strategies, business tips and more.

SemiQ launches 1200 V Third-Generation SiC MOSFET
Bruce Dickinson, Director of North America Sales at SemiQ, discusses the company’s newly launched QSiC 1200V MOSFET, a third-generation SiC device that shrinks the die size while improving switching speeds and efficiency. The device is 20% smaller versus QSiC’s second-generation SiC MOSFETs and has been developed to increase performance and cut switching losses in high-voltage applications. SemiQ is targeting a diverse range of markets including EV charging stations, solar inverters, industrial power supplies and induction heating.

SMU optimised for testing emerging nano/2D semiconductor devices
Chuck Cimino, Senior Product Manager for Lake Shore Cryotronics, explains the company’s new test instrument optimised for characterizing nanoscale and other low-power semiconductor devices. The new SMU-10 Source Measure Unit expands the module offering of Lake Shore’s MeasureReady M81-SSM Synchronous Source Measure (SSM) System and enables engineers to easily source and measure signals that would otherwise be swamped by electrical noise. Primary applications include I-V characterization of transistors used in specialized sensors, nanoelectromechanical systems (NEMS), quantum computer readout electronics, and emerging specialized and integrated circuit nanoscale semiconductor-based devices.

Optimism overrides any causes for concern
Philip Schluter, and Oliver Markl, both Partners at the leading European M&A and Debt Advisory firm, Pava Partners, discuss the state of the semiconductor industry – its size, its geographical and geopolitical strengths and weaknesses across Asia, Europe and North America, some of the key market drivers – the good and the not so good, concluding that there is every reason to be optimistic as to the future.

Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Anna Herr, scientific director at imec USA Florida, explains how record-performing NbTiN-based interconnects, Josephson junctions, and MIM capacitors open doors to energy-efficient compute systems for AI and HPC.

The world’s first silicon photonic chip for FHE
Nick New, CEO of Optalysys, explains how the company enables the future of secure compute by processing encrypted data at scale, without it being decrypted. It does this by using the power of advanced silicon photonics to enable Fully Homomorphic Encryption, a cryptographic technology to allow organisations to securely commercialise their data, providing several significant advantages to traditional electronic semiconductors.

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