Magnachip introduces TOLT-packaged MOSFET
Magnachip Semiconductor has releases a new 80V MXT MV MOSFET featuring a TOLT (TO-Leaded Top-Side Cooling) package. The company has already begun supplying the new MOSFET to a leading global electric motor manufacturer.
The TOLT-packaged MOSFET ( MDLT080N017RH) is aid to deliver a major advancement in thermal management. Unlike conventional TOLL (TO-Leadless) packages that dissipate heat through the bottom, the TOLT package is engineered to release heat directly from the top via a mounted metal heat sink. This structure substantially reduces thermal resistance between the junction and the external environment, making it well-suited for thermally demanding applications, such as e-scooters and LEVs.
Simulations and tests conducted by Magnachip demonstrated that its 80V MV TOLT package solution achieved an average 22 percent reduction in junction temperature (see above right) compared to using standard TOLL packages (see above left) .
This improvement also enhances the system reliability, according to the company, and the TOLT package enables compact, lightweight application designs.
