News Article
TSMC to exit GaN production
Taiwanese chip giant to repurpose Hsinchu fab due to rising price pressure from Chinese rivals
According to various reports,Taiwanese chip giant TSMC will wind down its GaN wafer foundry services by July 31, 2027, with related production lines at its Hsinchu Science Park fabs ceasing operations.
The reason for the decision is thought to be rising price pressure from Chinese rivals.
TrendForce says that TSMC plans to repurpose its Hsinchu Fab 5, which handles GaN production, for advanced packaging.
By reusing existing cleanroom facilities, TSMC can accelerate expansion with minimal effort, addressing demand for Chip-on-Wafer-on-Substrate, Wafer-on-Wafer (WoW), and Wafer-Level System Integration (WLSI) technologies, the report says.
