Infineon and Visteon to collaborate

Infineon Technologies and Visteon, a specialist in automotive electronics, have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.
The companies will collaborate and integrate power conversion devices based on Infineon semiconductors, with emphasis on wideband gap devices. Future Visteon EV powertrain applications incorporating Infineon CoolGaN and CoolSiC devices may include battery junction boxes, DC-DC converters and on-board chargers.
“Working with Infineon allows us to integrate cutting-edge semiconductor technologies that are essential in improving power conversion efficiency and overall system capability of next generation electric vehicles,” said Tao Wang, head of the electrification product line of Visteon.
“Visteon is a recognised innovator and an early adopter of new technologies, making them an ideal partner for us,” said Peter Schaefer, chief sales officer automotive, Infineon.