Infineon expands GaN power with 650V modules
Infineon is introducing the EasyPACK CoolGaN transistor 650 V module for high-power applications, to meet demand for higher performance with maximum ease of use.
“The CoolGaN-based EasyPACK power modules combine Infineon’s expertise in power semiconductors and power modules,” says Roland Ott, SVP and head of the Green Energy Modules and Systems Business Unit at Infineon. “This combination offers customers a solution that meets the increasing demand for high-performance and energy-efficient technologies in applications such as data centres, renewable energy, and EV charging.”
The EasyPACK CoolGaN module integrates 650 V CoolGaN power semiconductors with low parasitic inductances, achieved through compact die packing – enabling fast and efficient switching. Delivering up to 70 kW per phase with a single module, the design supports compact and scalable high-power systems, says Infineon.
Furthermore, it combines Infineon's .XT interconnect technology with CoolGaN options. The .XT technology is implemented on a high-performance substrate, reducing thermal resistance, which in turn translates to higher system efficiency and lower cooling demands.
Infineon has sold well over 70 million EasyPACK modules with various chipsets for a wide range of industrial and automotive applications. The EasyPACK series uses Infineon’s PressFIT contact technology, which ensures highly reliable and durable electrical connections between the module and the PCB.
The design is said to reduce manufacturing time and eliminates potential solder-related defects. Additionally, with its compact design, EasyPACK modules occupy up to 30 percent less PCB surface area than other conventional discrete layouts.
The newest 650 V CoolGaN generation is said to provide increased performance and figures of merit. Infineon’s benchmark data shows that CoolGaN Transistor 650 V G5 products provide up to 50 percent lower energy stored in the output capacitance (E oss), up to 60 percent improved drain-source charge (Q oss) and up to 60 percent lower gate charge (Q g).
The CoolGaN Transistor 650 V G5 product family offers a wide range of R DS(on) package combinations. Ten R DS(on) classes are available in various SMD packages, such as ThinPAK 5x6, DFN 8x8, TOLL and TOLT.
All products are manufactured on 8-inch production lines in Villach (Austria) and Kulim (Malaysia).
Infineon will show the EasyPACK modules with CoolGaN at PCIM 2025 in Nuremberg.
