Infineon combines silicon and SiC in e-mobility module
Infineon Technologies is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector.
The module is described as the first plug'n'play power module that implements a combination of Infineon’s silicon and SiC technologies, providing a balance between performance and cost efficiency.
One of the main differences between silicon and SiC in power modules is that SiC has a higher thermal conductivity, breakdown voltage and switching speed, making it more efficient, but also more expensive than silicon-based power modules.
With the new module, the SiC content per vehicle can be reduced, while maintaining vehicle performance and efficiency at a lower system cost. For example, system suppliers can realize nearly the system efficiency of a full SiC solution with only 30 percent SiC and 70 percent silicon area.
“Our new HybridPACK Drive G2 Fusion module underlines Infineon’s innovation leadership in the automotive semiconductor industry,” said Negar Soufi-Amlashi, SSVPt & general manager High Voltage at Infineon's Automotive division. “Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines SiC and silicon. Integrated in a well-introduced module package footprint it offers compelling cost-performance ratio over pure SiC modules without adding system complexity for automotive system suppliers and vehicle manufacturers.”
HybridPACK Drive G2 Fusion expands Infineon's HybridPACK Drive power module portfolio and can be easily integrated in vehicle components or modules without requiring complex adjustments or configurations.
The HybridPACK Drive G2 Fusion module features up to 220 kW in the 750 V class. It ensures high reliability over the entire temperature range from -40 °C to +175 °C and improved thermal conductivity. The properties of Infineon's CoolSiC technology and its silicon IGBT EDT3 technology with very fast turn-on enable the use of a single gate driver or dual gate drivers. This allows easy re-design from full silicon or full SiC based inverters to a fusion inverter.
Infineon will exhibit the new HybridPACK Drive G2 Fusion at electronica 2024 in Munich from November 12 to 15.
