Infineon launches high current density power modules
Infineon Technologies has launched the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for AI data centres. The modules enable vertical power delivery (VPD) and offer what is claimed to be the industry's best current density of 1.6 A/mm 2.
They follow the TDM2254xD dual-phase power modules introduced by Infineon earlier this year.
The TDM2354xD and TDM2354xT modules combine Infineon's robust OptiMOS 6 trench technology, a chip-embedded package that enables superior power density through enhanced electrical and thermal efficiencies, and a new inductor technology to enable lower profile and therefore, true vertical power delivery. As a result, the modules set new standards in power density and quality to maximise the compute performance and efficiency of AI data centres.
The TDM2354xT modules support up to 160 A and are said to be the industry's first Trans-Inductor Voltage Regulator (TLVR) modules in a small 8 x 8 mm² form factor.
Combined with Infineon's XDP controllers, they offer fast transient response and minimise on-board output capacitance by up to 50 percent, further increasing system power density.
Samples of the OptiMOS dual-phase power modules TDM2354xD and TDM2354xT are available now.
