Mitsubishi 12-inch wafers target power modules
Mitsubishi Electric has announced that its Power Device Works' Fukuyama Factory has begun large-scale supply of power semiconductor chips made from 12-inch silicon wafers for the assembly of semiconductor modules, effective immediately.
The silicon power-semiconductor modules will initially be used in consumer products.
Going forward, Mitsubishi Electric says it expects to contribute to green transformation by providing a stable and timely supply of semiconductor chips to meet the growing demand for energy-saving power-electronics devices in various applications.
The Fukuyama Factory is playing a key role in Mitsubishi Electric's medium-term plan to double its wafer processing capacity for silicon power- semiconductors by fiscal 2026 compared to five years earlier.
