Rohm launches 2-in-1 SiC moulded module
Rohm has developed the DOT-247 a 2-in-1 SiC moulded module (SCZ40xxDTx, SCZ40xxKTx), for industrial applications such as PV inverters, UPS systems, and semiconductor relays.
The module is said to retain the versatility of the widely adopted TO-247 package while achieving high design flexibility and power density.
The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through an unique internal structure.
Additionally, through an optimised package structure, thermal resistance has been reduced by approximately 15 percent and inductance by approximately 50 percent compared to the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration – achieving the same power conversion circuit in approximately half the volume.
The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages.
In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed – making custom products necessary in many cases when using conventional SiC modules.
To address this challenge, Rohm has developed each of these two topologies – the smallest building blocks of multi-level circuits – into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.
Evaluation boards will be made available progressively to facilitate evaluation during application design.
