Rohm and Infineon to collaborate on SiC packages
Rohm and Infineon have signed an agreement to collaborate on packages for SiC power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centres.
The partners aim to enable each other as second sources of selected packages for SiC power devices, a move which will increase design and procurement flexibility for their customers. In the future, customers will be able to source devices with compatible housings from both Rohm and Infineon.
As part of the agreement, Rohm will adopt Infineon’s innovative top-side cooling platform for SiC, including TOLT, D-DPAK, Q-DPAK, Q-DPAK dual, and H-DPAK packages. Infineon's top-side cooling platform offers several benefits, including a standardised height of 2.3 mm for all packages.
At the same time, Infineon will take on Rohm’s DOT-247 package with SiC half-bridge configuration to develop a compatible package. That will expand Infineon’s recently announced Double TO-247 IGBT portfolio to include SiC half-bridge solutions.
Rohm's DOT-247 delivers higher power density and reduces assembly effort compared to standard discrete packages. Featuring a unique structure that integrates two TO-247 packages, it enables to reduce thermal resistance by approximately 15 percent and inductance by 50 percent compared to the TO-247. The advantages bring 2.3 times higher power density than the TO-247.
Rohm and Infineon plan to expand their collaboration in the future to include other packages with both silicon and wide-bandgap power technologies such as SiC and GaN.
"We are excited about working with Rohm to further accelerate the establishment of SiC power devices," said Peter Wawer (above left), division president green industrial power at Infineon. "Our collaboration will provide customers with a wider range of options and greater flexibility in their design and procurement processes, enabling them to develop more energy-efficient applications that will further drive decarbonisation."
"Rohm is committed to providing customers with the best possible solutions. Our collaboration with Infineon constitutes a significant step towards the realisation of this goal, since it broadens the portfolio of solutions," said Kazuhide Ino (above right), member of the board, managing executive officer, in charge of power devices business at Rohm.
