News Article

Mitsubishi to ship samples of HVIGBT module

Tuesday 8th April 2025

Designed for efficient and powerful inverter systems in trains and other large industrial equipment

Mitsubishi Electric will shortly begin shipping samples of its new XB Series high-voltage IGBT module, a 3.3kV, 1500A high-capacity power semiconductor for large industrial equipment such as railway vehicles.

By adopting proprietary diode and IGBT elements, as well as a unique chip termination structure, the company says the module's improved moisture resistance will help to improve the efficiency and reliability of inverters for large industrial equipment operating in diverse environments.

Mitsubishiwill exhibit the XB Series HVIGBT module at Power Conversion Intelligent Motion (PCIM) Expo & Conference 2025 in Nuremberg, Germany from May 6 to 8.

The new 3.3kV/1500A XB Series HVIGBT module uses IGBT elements incorporating Mitsubishi's proprietary relaxed field of cathode (RFC) diode and carrier-stored trench-gate bipolar transistor (CSTBT1) structure.

In particular, the module reduces total switching loss by approximately 15 percent compared to previous models, contributing to higher efficiency in inverters. It also expands tolerance in the reverse-recovery safe-operating area (RRSOA) by about 25 percent compared to previous models, further enhancing inverter reliability.

In addition, by using a new electric field relaxation structure and a surface charge control structure in the chip's termination area, Mitsubishi says it has reduced the area's size by about 30 percent while achieving about 20 times greater moisture resistance than existing products.

Mitsubishi to ship samples of HVIGBT module

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