Loading...
News Article

IceMOS closes $22m funding round to launch new MOSFET tech

News
Funding found will help launch patented high voltage mSJMOS power semiconductor technology

Arizona-based semiconductor manufacturer IceMOS Technology has completed Series E funding from a London-based investor, 57 Stars LLC, and earlier stage US investors.

The investment will fund the launch of a patented power semiconductor technology called mSJMOS, which integrates silicon MEMS manufacturing techniques with mature node CMOS Super-junction power MOSFET structures. The resultant MOSFETs deliver dramatic semiconductor energy efficiency, according to IceMOS.

Samuel J. Anderson, MBE, IceMOS technology founder and chairman said: "The merging of mSJMOS structures and MEMS manufacturing techniques presents a revolutionary silicon-based technology that can compete with wideband gap devices at 650 Volts, 750V, 900V, and 1200V.”

Headquartered in Paradise Valley, Arizona, the company has a manufacturing centre in Northern Ireland, and a design centre in Tokyo, Japan. Part of the investment will enable IceMOS to increase strategic manufacturing in Northern Ireland, device design capability, applications engineering, marketing and sales worldwide as it starts preparation to launch mSJMOS platforms.


IceMOS closes $22m funding round to launch new MOSFET tech
WHU-USTC team demo novel temperature monitoring of GaN device
4-inch gallium oxide facility established in Swansea
Mazda and Rohm collaborate on automotive GaN
Infineon announces 24/48V smart power switch family
Wolfspeed appoints new CEO amidst funding crisis
Farnell adds new discrete semis portfolio
SiC slowdown is only short term, says Yole
EU project to develop 1200V DC powertrain
£250m to turbocharge Welsh compound semi cluster
ST adds intelligent power switches
Vishay Gen 4.5 650V MOSFET has lowest on-resistance
Pulsiv wins PSMA's first Global Energy Efficiency Award
Boosting the blocking voltage of birectional HEMTs
Taking power conversion to the next level
UK establishes semiconductor design centre
TU Graz and Silicon Austria Labs launch power lab
Scotland gets £9m funding for power packaging
EPC/Innoscience patent battle continues
TI announces new integrated GaN stages
EPC adds next gen 100V GaN FET
Power Integrations launches fifth generation TinySwitch ICs
Taiwan Semi adds 80V/100V MOSFETs to PerFET family
Nexperia 1200 V SiC MOSFETs now in top-side cooled X.PAK
NREL team advances substrate engineering
Nexperia expands GaN FET portfolio
Infineon unveils next generation data centre power modules
Enphase benefits from 600V CoolMOS 8 MOSFETs
Onsemi launches SiC-based IPMs
NoMIS increases SiC short-circuit withstand time
Navitas announces single-stage BDS Converters
Keysight enables dynamic test of bare die WBG power chips

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: