Infineon unveils next generation data centre power modules
Infineon has launched its next generation of high-density power modules which play a pivotal role in enabling AI and high-performance computing.
The new OptiMOS TDM2454xx quad-phase power modules are said to enable best-in-class power density and total-cost-of-ownership (TCO) for AI data centre operators.
The OptiMOS TDM2454xx quad-phase power modules enable true vertical power delivery (VPD) and offer a current density of 2 Ampere per mm². The modules follow the OptiMOS TDM2254xD and the OptiMOS TDM2354xD dual-phase power modules introduced by Infineon last year.
In traditional horizontal power delivery systems, power needs to travel across the surface of the semiconductor wafer, which can result in higher resistance and significant power loss. Vertical power delivery minimises the distance that power needs to travel, thereby reducing resistive losses enabling increased system performance.
The OptiMOS TDM2454xx modules are a fusion of Infineon's robust OptiMOS 6 trench technology, chip-embedded package for superior electrical and thermal efficiencies, and innovative low-profile magnetic design that continue to push the envelope for performance and quality of VPD systems.
Additionally, the OptiMOS TDM2454xx has a footprint that is designed to enable module tiling and improving current flow that enhance electrical, thermal and mechanical performance. The OptiMOS TDM2454xx modules support up to 280A across four phases with an integrated embedded capacitor layer within a small 10x9mm² form factor. Combined with Infineon's XDP controllers, they offer a robust power solution with improved system power density.
