Infineon unveils next-gen vertical power modules
Infineon Technologies has launched its next generation of high-density power modules for enabling AI and high-performance computing.
The new OptiMOS TDM2454xx quad-phase power modules are said to enable true vertical power delivery (VPD) and ri offer industry's best current density of 2 Ampere per mm².
In traditional horizontal power delivery systems, power needs to travel across the surface of the semiconductor wafer, which can result in higher resistance and significant power loss. Vertical power delivery minimises the distance that power needs to travel, thereby reducing resistive losses enabling increased system performance.
Data centres are currently responsible for two percent of global energy consumption according to the IEA. Fueled by AI, the power demands within data centres are expected to grow by 165 percent between 2023 and 2030. Continually improving the efficiency and power densities of power conversion from grid-to-core is vital to enable further advancements in compute performance while reducing TCO.
“We are proud to expand our high-performance AI data centre solutions with the OptiMOS TDM2454xx VPD modules,” said Rakesh Renganathan, VP power ICs at Infineon Technologies. “We take a three-dimensional design approach and leverage our industry-leading power devices, packaging technologies and extensive systems expertise to provide high-performance and energy-efficient computing solutions as part of our mission to drive digitalisation and decarbonisation.”
The OptiMOS TDM2454xx modules are a fusion of Infineon's robust OptiMOS 6 trench technology, chip-embedded package for superior electrical and thermal efficiencies, and innovative low-profile magnetic design that continue to push the envelope for performance and quality of VPD systems. Additionally, the OptiMOS TDM2454xx has a footprint that is designed to enable module tiling and improving current flow that enhance electrical, thermal and mechanical performance.
The OptiMOS TDM2454xx modules support up to 280A across four phases with an integrated embedded capacitor layer within a small 10x9mm² form factor. Combined with Infineon's XDP controllers, they offer a robust power solution with improved system power density.
