Infineon starts 200mm SiC product-roll out
Infineon Technologies has announced significant progress along its 200 mm SiC roadmap, with customers receiving the first products based on the technology in Q1 2025.
Manufactured in Villach, Austria, these new SiC power devices are targeted for use in renewable energy applications, trains, and electric vehicles.
Additionally, Infineon says the transition of its site in Kulim, Malaysia from 150mm to 200mm wafers is on track. The newly built Module 3 is poised to start high-volume production to meet market demand.
Rutger Wijburg, COO of Infineon said: “By ramping up SiC production in Villach and Kulim in phases, we are improving cost-efficiency and continuing to ensure product quality. At the same time, we are making sure our manufacturing capacities can meet the demand for SiC-based power semiconductors.”
Infineon’s production sites in Villach and Kulim share technologies and processes which allows for fast ramping in both SiC and GaN manufacturing, according to the company.
