Hesse Mechatronics joins Obama's next gen power electronics institute
The focus of the project will be on widebandgap semiconductors such as silicon carbide and gallium enable smaller, faster and more reliable power electronic devices than those that are silicon-based
A consortium of eighteen companies and six universities are partnering with the US government to strengthen US manufacturing.
Hesse Mechatronics will provide wedge bonding process knowledge and equipment to the consortium.
Proposed in the President's latest State of the Union address, The Next Generation Power Electronics Institute is now a reality led by North Carolina State University.
The consortium is one of three initiatives by President Obama to bring together research and product development in a collaborative effort among companies, universities, training and academic institutions, and federal agencies.
The consortium will serve as a "teaching factory," supporting students and workers, in addition to enabling small manufacturers to access cutting edge capabilities, manufacturing processes and equipment to design, test and produce next generation power electronics products in the USA.
Wide Bandgap Semiconductor Devices
Superior semiconductor materials will enable greater energy efficiency in industrial-scale power electronics and clean energy technologies says the U.S. Department of Energy.
Wide bandgap semiconductor materials, the focus of The Next Generation Power Electronics Institute, enable smaller, faster and more reliable power electronic devices than those that are silicon-based.
Harnessing the benefits of wide bandgap semiconductor technology, including reduced weight, volume and costs, can lead to significant energy savings in products such as industrial processing equipment and consumer appliances, in addition to accelerating the adoption of new technologies including electric vehicles and renewable energy.
Hesse Mechatronics has become known for supporting educational institutions in the development of emerging technologies in the field of backend semiconductor assembly, specifically wedge wire bonding. The company will provide the consortium with its wire bonding equipment and ongoing process knowledge with respect to thin and heavy wire wedge bonding, ribbon bonding and a variety of metallisation processes and materials.
President Obama's US manufacturing initiativesNext Generation Power Electronic Manufacturing Institute
Wide bandgap semiconductor technology
Hesse Mechatronics
To see wire bonding in action
