Datapaq Introduces New Solution for In-process Temperature Profiling
Datapaq has announced a temperature profiling system designed specifically for use in hot vacuum processes.
Measuring accurate product temperatures in these processes has always been a challenge as the airlocks and seals prevent the use of trailing thermocouples.
The Datapaq in-process profiler passes through the process chambers along with the product being measured. It uses short thermocouples to take measurements directly from the product at all stages of the process. The users can check uniformity of heating at every stage of the process and optimize the process settings to improve both product quality and production yields.
Up to six thermocouples are attached to the Q18 data logger which records detailed temperature profiles. The logger is protected from the heat of the furnace by a revolutionary low-height reflective-plate technology thermal barrier that has been designed to ensure there is no outgassing. As a consequence of this profiling can be conducted regularly with minimal process disruption.
The system is completed by the Insight Analysis software. This software translates the temperature readings into meaningful information quickly enabling the engineers to focus on optimizing the process.
