News Article
Towa inaugurates packaging centre in Netherlands
Due to the increase in development in new semiconductor devices including sensors and MEMS and other electronic products, the Towa corporation of Japan has established a new centre in Europe
Following an announcement in January, the packaging development centre (PDC) of Towa Europe B.V., in the Netherlands officially opened in the presence of the staff and a large group of people.
The opening included suppliers and other relations and representatives of the Duiven municipality, the Netherlands Foreign Investment Agency (NFIA) and Oost N.V.
After a word of welcome and an introduction by the director of Towa Europe B.V., Huub Claassen, a message from the president of the Towa Corporation of Japan, Hirokazu Okada, was read by Pete Molenaar, marketing manager of Towa Europe B.V.
In this message Okada said, "I am extremely happy that we can open this PDC here in Duiven in Europe today and I hope that companies here in the Netherlands and in the other European countries will find the way to work together with Towa Europe PDC".
Then Muneo Miura, representing the Japanese headquarters, pressed a button on one of the Towa systems after which the first product was produced and after a toast by H.B.I de Lange, mayor of the Duiven municipality, the official opening became fact.
Before and after the opening ceremony there was an opportunity for all present, to discover the offices and laboratory rooms with the Towa molding systems and test- and measuring equipment as well as samples, produced on Towa machines.
Because of the increase in development in Europe of new semiconductor devices, sensors, LED's, MEMS en other electronic products it has been decided by the Towa corporation of Japan to establish this Packaging Development Centre in the Netherlands.
The staff of the research centre consist of a team of experienced engineers. There is a well equipped laboratory with 2 Towa molding systems, test- and measuring equipment. Therefore support can be given in all phases of packaging development, from concept up to test, qualification and industrialization.
Also the European Marketing, Sales and Service department for the Towa systems is located at this new facility.
The Towa Corporation of Japan develops molding processes and equipment for leadframe, substrate, large panels and wafer level packaging applications in end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy.
The opening included suppliers and other relations and representatives of the Duiven municipality, the Netherlands Foreign Investment Agency (NFIA) and Oost N.V.
After a word of welcome and an introduction by the director of Towa Europe B.V., Huub Claassen, a message from the president of the Towa Corporation of Japan, Hirokazu Okada, was read by Pete Molenaar, marketing manager of Towa Europe B.V.
In this message Okada said, "I am extremely happy that we can open this PDC here in Duiven in Europe today and I hope that companies here in the Netherlands and in the other European countries will find the way to work together with Towa Europe PDC".
Then Muneo Miura, representing the Japanese headquarters, pressed a button on one of the Towa systems after which the first product was produced and after a toast by H.B.I de Lange, mayor of the Duiven municipality, the official opening became fact.
Before and after the opening ceremony there was an opportunity for all present, to discover the offices and laboratory rooms with the Towa molding systems and test- and measuring equipment as well as samples, produced on Towa machines.
Because of the increase in development in Europe of new semiconductor devices, sensors, LED's, MEMS en other electronic products it has been decided by the Towa corporation of Japan to establish this Packaging Development Centre in the Netherlands.
The staff of the research centre consist of a team of experienced engineers. There is a well equipped laboratory with 2 Towa molding systems, test- and measuring equipment. Therefore support can be given in all phases of packaging development, from concept up to test, qualification and industrialization.
Also the European Marketing, Sales and Service department for the Towa systems is located at this new facility.
The Towa Corporation of Japan develops molding processes and equipment for leadframe, substrate, large panels and wafer level packaging applications in end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy.
