Plan Optik implements high accuracy laser patterning technology
Plan Optik AG manufacturer of glass, quartz and glass-Si compound wafers has added laser patterning to its structuring techniques recently. Glass, quartz (eg fused silica) and silicon can be patterned generating an extremely high accuracy.
Laser patterning is used for small feature sizes down to 20 microns. Patterning of different layer depths typically requires different process runs. Between each run, alignment to the previous layer is mandatory. In laser patterning, different layers will be processed in one run. No alignement will be necessary which increases layer to layer accuracy dramatically.
Compared to other common patterning techniques such as wet-chemical etching or sand blasting, laser patterning enables much higher aspect ratios and leads to a much better accuracy and very smooth patterned edges.
Even pre-cutting or dicing into small dies can be materialized.
Laser patterning works directly from your layout file which could be .dxf, .gds or .dwg. Other file types could typically also be used after converting them. This enables a very fast and cheap prototyping since no masks are needed.
Plan Optik AG implemented laser patterning in addition to it's already existing bulk micro machining methods. Together with wet etching, ultra sonic drilling, diamond tool drilling and sand blasting Plan Optik is now using all relevant glass and quartz surface micro machining methods in house. This makes Plan Optik the one stop shop for all patterned glass and quartz parts for MEMS and semiconductor applications.
