+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

EPC Introduces eGaN chips for A4WP Wireless Power Transfer

First devices to include both monolithic half bridge and integrated bootstrap functions

EPC has announced the EPC2107 (100V) and EPC2108 (60V) eGaN half bridge power chips with integrated bootstrap FET, eliminating gate driver induced reverse recovery loses as well as the need for a high side clamp. This is the first time that a bootstrap FET has been integrated in an eGaN power circuit.

Designed specifically for A4WP standard (Rezence) resonant wireless power transfer applications, these products enable rapid design of highly efficient end-user systems, setting the stage for mass adoption of wireless power transfer. In addition, these GaN power integrated circuits come in small, chip-scale packages, reducing the size of the overall system. This new line of chips is lower in cost due to reduced overall component count - one GaN device versus three FETs.

Wireless charging  is a rapidly emerging market that is expected to be a $15.6 billion industry by 2020. There are several standards for wireless power transfer. According to EPC, the A4WP standard allows for spatial freedom when charging, eliminating the need for exact positioning of devices when charging. It also has a wide charging range, providing consumers with 'drop and go' charging.

Additionally, says EPC, the A4WP standard allows for charging multiple devices with different power requirements simultaneously. Another key feature is that Rezence compliant wireless power systems will charge devices in the presence of metallic objects such as keys, coins, and utensils, making it an ideal choice for automotive, retail, and household applications.

EPC introduced the first eGaN FET for wireless power transfer in 2012. In addition to designing A4WP Rezence compliant power products, EPC has published a Wireless Power Handbook dedicated to addressing wireless power systems design issues such as multi-mode operation and EMI compliance.

These devices come in 1.35 mm x 1.35 mm chip-scale package for reduced size, improved switching speed, and thermal performance leading to increased power density.

In support of the EPC2107 and EPC2108 integrated circuits, EPC also offers complete demonstration wireless power transfer systems, as well as development boards for chip evaluation. 

 


×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: