News Article
Optimise the processing of III/V materials
Logitech state "The development of new semiconductor and optical technologies can be seriously hampered by variability in the wafer lapping and polishing process."
At the Compound Semiconductor International Exhibition and Conference in Frankfurt, 11th "“12th March 2015, Logitech Ltd can demonstrate how their lapping and polishing systems can help optimise the processing of III/V materials, such as removing process variability, increasing accuracy and material removal rates.
The two day global event will give a comprehensive view of the Compound Semiconductor industry with over 30 presentations discussing the market evolution, new device technology and details of advances in tools and processes.
Why not come along to our booth and visit us at the show!
http://www.logitech.uk.com
www.cs-international.net
