VIDEO
STILE technology strengthens US semiconductor packaging advancements
Video Summary
Ron Huemoeller, CEO of Saras Micro Devices is bringing its expertise in power delivery solutions to two high-impact semiconductor research projects, each awarded $100 million under the U.S. Department of Commerce CHIPS National Advanced Packaging Manufacturing Program (NAPMP). By integrating its STILEā¢ technology, Saras is helping drive advancements in power efficiency and chiplet integration for high-performance computing (HPC) and AI applications.
