VIDEO
Paving the way for cost-effective mmWave communication and sensing
Video Summary
imec's Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz. Using RF silicon interposer technology to combine high-performance III-V chiplets with silicon-based wafer-scale packaging is a significant milestone in developing compact, energy-efficient modules for above 100GHz communication and radar sensing.
