VIDEO
ZEISS launches FIB-SEM optimised for TEM sample preparation
Video Summary
Dr. Thomas Rodgers, head of business sector electronics at ZEISS Microscopy, talks through the company’s new ZEISS Crossbeam 550 Samplefab. Built for efficiency and throughput in the semiconductor lab, ZEISS Crossbeam 550 Samplefab provides recipe-based automation for the routine TEM sample preparation work of bulk milling, lift-out and thinning at any number of target points on the sample. The solution promises an automation yield of >90% for processing lamellae from bulk to TEM grid without operator intervention.
