VIDEO
Terecircuits shares material science innovations for advanced packaging applications
Video Summary
Wayne Rickard, Terecircuits CEO, outlines the company’s decision to join the US’s National Semiconductor Technology Center, contributing its considerable expertise in the synthesis, characterization and delivery of polymers, encapsulants and thin film coatings for advanced packaging. Wayne explains that, in working alongside industry leaders across the U.S. semiconductor ecosystem, Terecircuits can accelerate the development of advanced material solutions for heterogeneous integration and, in so doing, is helping to tackle critical challenges in high-density, high-performance chip manufacturing.
