Power performance solutions leverage integrated packaging design

Set against the backdrop of the upcoming SEMICON West event, Eelco Bergman, Chief Business Officer, Saras Micro Devices, explains how the company is transforming the way power is delivered to advanced semiconductor devices with its STile technology: a passive 3D integrated and centralized power delivery module embedded in the package substrate core that maximizes computing power for cutting-edge applications like high-performance computing (HPC), AI, and more.