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Thursday 4th February 2016
Acquisition adds 28,000 wafers per month capacity
Thursday 4th February 2016
Aims to encourage innovative thinking in semiconductor manufacture
Wednesday 3rd February 2016
40 percent reduction in size and a 20 percent reduction in system cost
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Friday 29th January 2016
Falling SiC raw material price is driving development of high value-added SiC wafer products
Thursday 28th January 2016
eGaN technology enables higher efficiency and power density at higher frequencies and currents
Wednesday 27th January 2016
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Wednesday 27th January 2016
Monday 25th January 2016
Mitsubishi and partners focus on chemical industry for high efficiency heating approach

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