AOS expands surface mount package offering
Alpha and Omega Semiconductor Limited (AOS) has announced a new robust power MOSFET LFPAK 5x6 package, available in 40V, 60V, and 100V versions.
According to the company, LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedised solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing.
Another feature enhancement is the LFPAK’s larger copper clip, designed to improve electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications.
AOS says that these features significantly improve the robustness of the MOSFET, and utilising AOS’s shielded gate MOSFET Technology (AlphaSGT) enable designers to find an optimised solution to achieve high reliability under the harshest environmental conditions.
The LFPAK 5x6 family is immediately available in production quantities with a lead time of 14-16 weeks. The unit price for 1,000 pieces for AOLF66412, AOLF66413, AOLF66417, AOLF66610, and AOLF66910 are respectively $1.15, $1.17, $0.78, $1.65, and $2.1.
