Monday 6th August 2018
Thursday 2nd August 2018
Three part 'Mobility (R)Evolution' seres explores new technologies for electrification and autonomous driving
Thursday 2nd August 2018
First GaN based solution that can deliver up to 9kW of power without the need for paralleling
Thursday 2nd August 2018
AEC-Q101-qualified and PPAP-capable E-Series said to offer highest available power density and durability
Thursday 2nd August 2018
New LNA and phase shifter MMICs target EW, communications receivers and phased array radar applications
Tuesday 31st July 2018
Monday 30th July 2018
Friday 27th July 2018
Honda Motor Co., Ltd. and Panasonic Corporation announced plans to conduct a research experiment in Indonesia on battery sharing using the Honda Mobile Power Pack (“Mobile Power Packâ€) detachable mobile battery with electric mobility products, including electric motorcycles powered by the Mobile Power Pack.
Thursday 26th July 2018
Power Electronics World invited the gallium nitride (GaN) transistor experts at GaN Systems to provide an introduction to the capabilities of high power density, wide bandgap semiconductors for designers who have worked primarily in silicon technologies. This article is the first in a three-part series. By: Paul Wiener, VP Strategic Marketing, GaN Systems
Monday 23rd July 2018
Monday 16th July 2018
Thursday 12th July 2018
Ministers’ commitment to key role of gas in energy mix is “common sense†as National Grid publishes future energy scenarios, union says
Tuesday 10th July 2018
Monday 9th July 2018
Higher-level building blocks are suitable for SWaP-C optimised high power amplifiers (HPAs) found in pulsed and CW radar systems
Friday 6th July 2018
Yole forecasts a $1.4 billion SiC power semiconductor market by 2023
Thursday 5th July 2018
Thursday 5th July 2018
Many nations have mandated the phase-out of internal combustion engines in the coming decades to meet global greenhouse gas reduction targets. Electric vehicle (EV) performance can be optimized by utilizing advanced design and simulation tools that save manufacturers time and money. By Guilherme Tondello, Creative Solutions, and Puneet Sinha, Mentor-A Siemens Business, Mechanical Analysis Division
Wednesday 4th July 2018
Highly scalable US plant will meet growing demand for high quality SiC material
Tuesday 3rd July 2018
Caption: (L to R) Peter Myatt, ABB Channel Manager- Drives shakes hands with EDC managing director Nick Brown
Tuesday 3rd July 2018
Advanced semiconductors now support previously unattainable efficiency and power density. But these devices place high demands on test and measurement (T&M) equipment; oscilloscopes with isolated input channels are ideal solutions with wide-ranging analytical abilities. By: Dr. Markus Herdin, Product Manager for Oscilloscopes, Rohde & Schwarz, Munich
Monday 2nd July 2018
Imec and UTAC have developed a unique process for the wafer thinning and backside metallization of highly stressed GaN-on-200 mm silicon wafers.
This has resulted in a packaged 650 V GaN device – smaller than state-of-the-art. Stefaan Decoutere, Program Director GaN Power Electronics at imec and Nicolo Ronchi, Researcher at imec explains the process.
Thursday 28th June 2018
Wednesday 27th June 2018
Tuesday 26th June 2018
