Wolfspeed launches Gen 4 SiC MOSFET technology
Wolfspeed has introduced its new Gen 4 SiC technology platform, which it says is engineered to simplify switching behaviours and design challenges commonly experienced in high-power designs.
With availability in 750V, 1200V and 2300V devices, the Gen 4 platform will be delivered on 200mm wafers, promising the delivery of products "on a scale and level of yield not seen in this industry before,” according to Wolfspeed executive chairman, Tom Werner.
“We understand that each application’s design comes with a unique set of requirements,” added Jay Cameron, senior vice president of Wolfspeed power products. “From its inception, our goal for Gen 4 has been to improve overall system efficiency in real-world operating environments, with a focus on delivering maximum performance at the system level. Gen 4 enables design engineers to create more efficient, longer-lasting systems that perform well in tough operating environments at a better overall system cost.”
Benefits include up to 21 percent reduction in on-resistance at operating temperatures with up to 15 percent lower switching losses. In addition the technology offers high reliability with a short-circuit withstand time of up to 2.3 µS to provide additional safety margin.
Another feature (illustrated above) is Gen 4 's 3.5x improved body diode softness factor, which minimises EMI during reverse recovery scenarios, delivering smoother operation. In it's whitepaper about the technology, Wolfspeed says that "switching is both safe and clean, even at high dV/dt, supported by an up-to 600:1 capacitance ratio, which eliminates parasitic overshoot risks and ensures reliable system performance under demanding conditions."
Wolfspeed is the only SiC producer with both SiC material and SiC device fabrication facilities based in the United States, a factor that it says is becoming increasingly important under the new US Administration’s increased focus on national security and investment in US semiconductor production.
Wolfspeed’s Gen 4 products are available in 750V, 1200V and 2300V nodes, with options for power modules, discrete components, and bare die products. New product introductions, including additional footprints and RDSON ranges, will be available throughout 2025 and early 2026.
