Loading...
News Article

Rohm and TSMC launch EV GaN partnership

News

Partnership will integrate Rohm's device development technology with TSMC's GaN-on-silicon processes

Rohm and TSMC have entered a strategic partnership on development and volume production of GaN power devices for electric vehicle applications.

The partnership will integrate Rohm's device development technology with TSMC's GaN-on-silicon processes to meet the growing demand for high-voltage and high-frequency properties over silicon for power devices.

The partnership builds on Rohm and TSMC’s history of collaboration in GaN power devices. In 2023, Rohm adopted TSMC’s 650V GaN HEMT, whose process is increasingly being used in consumer and industrial devices as part of Rohm's EcoGaN series, including the 45W AC adapter (fast charger) "C4 Duo" produced by Innergie, a brand of Delta Electronics, Inc.

"GaN devices, capable of high-frequency operation, are highly anticipated for their contribution to miniaturization and energy savings, which can help achieve a decarbonized society. Reliable partners are crucial for implementing these innovations in society, and we are pleased to collaborate with TSMC, which possesses world-leading advanced manufacturing technology" said Katsumi Azuma, member of the board and senior managing executive Ooficer at Rohm. “In addition to this partnership, by providing user-friendly GaN solutions that include control ICs to maximise GaN performance, we aim to promote the adoption of GaN in the automotive industry."

“As we move forward with the next generations of our GaN process technology, TSMC and Rohm are extending our partnership to the development and production of GaN power devices for automotive applications,” said Chien-Hsin Lee, senior director of specialty technology business development at TSMC. “By combining TSMC's expertise in semiconductor manufacturing with Rohm's proficiency in power device design, we strive to push the boundaries of GaN technology and its implementation for EVs.”

Partnership aims to secure US gallium supply
Infineon introduces new automotive PMIC
Navitas’ GaN and SiC chips power AI notebooks
Nordic Semi's PMIC extends primary battery life
APC Electronics partners with Luminus Devices
SiC patenting strong in Q4 2024, says KnowMade
Yokogawa releases probes for power measurement
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
Innoscience files lawsuit against Infineon
Forvia Hella to use CoolSiC for next generation charging
Toshiba introduces 50V/3.0A motor driver IC
Infineon introduces new gate drivers for EVs
German start-up secures finance for SiC processing tech
Power Integrations announces MotorXpert v3.0
Nordic Semi adds new PMIC for low energy products
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Step-down DC-DCs offer lowest quiescent current
Farnell to stock tiny DC/DC regulator
Polar Semi licenses Tower's BCD tech
Researchers develop tech for future fast-charging stations
Vermont GaN Tech Hub awarded nearly $24M
Onsemi completes buy-out of Qorvo SiC JFET business
Boosting AlN-on-AlN Schottky barrier diode performance

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: