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Vishay increases MOSFET efficiency

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150V TrenchFET device in PowerPAK SO-8S features industry's lowest RDS(ON) of 5.6mΩ at 10V

Vishay Intertechnology has introduced a150 V TrenchFET Gen V n-channel power MOSFET in the PowerPAK SO-8S (QFN 6x5) package to provide higher efficiency and power density for telecom, industrial, and computing applications.

Compared to previous-generation devices in the PowerPAK SO-8, the Vishay Siliconix SiRS5700DP slashes overall on-resistance by 68.3 percent and on-resistance times gate charge — a key figure of merit (FOM) for MOSFETs used in power conversion applications — by 15.4 percent while providing 62.5 percent lower RthJC and 179 percent higher continuous drain current.

Claimed to have the industry's lowest on-resistance of 5.6 mΩ at 10V and on-resistance times gate charge FOM of 336 mΩ*nC, the device minimises power losses from conduction. This allows designers to boost efficiency to meet next-generation power supply requirements, such as 6 kW AI server power systems. In addition, the extremely low 0.45 °C/W RthJC of the PowerPAK SO-8S package enables continuous drain current up to 144 A to increase power density while providing robust SOA capability.

The SiRS5700DP is suitable for synchronous rectification, DC/DC converters, hot swap switching, and OR-ing functionality. Typical applications will include servers, edge computing, super computers, and data storage; telecom power supplies; solar inverters; motor drives and power tools; and battery management systems.

RoHS-compliant and halogen-free, the MOSFET is 100 percent Rg and UIS tested and complies with IPC-9701 criteria for more reliable temperature cycling. The device's standard 6 mm by 5 mm footprint is fully compatible with the PowerPAK SO-8 package.

Samples and production quantities of the SiRS5700DP are available now.


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