Rohm SiC SBDs feature new package design
Rohm Semiconductor has announced new surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals.
The initial lineup includes eight models (SCS2xxxNHR) for automotive applications such as onboard chargers (OBCs), with plans to deploy eight additional models (SCS2xxxN) for industrial equipment such as FA devices and PV inverters in December 2024.
The new products use an original design that removes the centre pin previously located at the bottom of the package, extending the creepage distance to a minimum of 5.1mm, approximately 1.3 times greater than standard products. This minimizes the possibility of tracking (creepage discharge) between terminals, eliminating the need for insulation treatment through resin potting when surface mounting the device on circuit boards in high-voltage applications.
Additionally, the devices can be mounted on the same land pattern as standard and conventional TO-263 package products, allowing an easy replacement on existing circuit boards.
Two voltage ratings are offered – 650V and 1200V – supporting 400V systems commonly used in xEVs, as well as higher voltage systems expected to gain wider adoption in the future. The automotive-grade SCS2xxxNHR are AEC-Q101 qualified, ensuring they meet the high reliability standards this application sector demands.
