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Friday 3rd March 2017
Insulating layer in SOI wafers also improves breakdown characteristics for power electronics
Tuesday 28th February 2017
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Monday 27th February 2017
Thursday 23rd February 2017
Positive net income in Q4 but negative for the year due to high R&D costs
Thursday 23rd February 2017
Thursday 23rd February 2017
New package options allow 'new topologies not possible with existing products'
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Wednesday 22nd February 2017
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Tuesday 21st February 2017
AllGaN integration solves 30-year industry challenge in high-speed, high-voltage power electronics
Friday 17th February 2017
SOI substrates exhibited lower stress and higher crystalline quality
Thursday 16th February 2017
AESA fighter radar and electronic warfare suite uses latest GaN and SiC substrates
Thursday 16th February 2017
Project gives performance and cost comparison of two major reactor platforms 

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