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GlobalWafers to get $400M under the CHIPS Act

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Funding to include investment in 150mm and 200mm SiC wafer manufacturing in Sherman, Texas

The US Department of Commerce is providing GlobalWafers of Taiwan up to $400 million funding under the CHIPS and Science Act to help onshore critical semiconductor production, including SiC wafer production .

This proposed investment will support projects with total capital expenditures of approximately $4 billion.

GlobalWafers will build and expand facilities in Sherman, Texas to establish the first 300mm silicon wafer manufacturing facility for advanced chips in the United States.

GlobalWafers also plans to convert a portion of its existing silicon epitaxy wafer manufacturing facility in Sherman, to SiC epitaxy wafer manufacturing, producing 150mm and 200mm SiC epitaxy wafers.

In St. Peters, Missouri, GlobalWafers will establish a new facility to produce 300mm silicon-on-insulator (SOI) wafers.


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