TI pioneers magnetic packaging for power modules
Texas Instruments has introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI.
The power modules use TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23 percent compared to competing modules.
According to TI, three of the six new devices, the TPSM82866A, TPSM82866C and TPSM82816, are the industry's smallest 6A power modules, supplying an industry-leading power density of nearly 1A per 1mm2 of area.
"Designers turn to power modules to save on time, complexity, size and component count, but these benefits have required a compromise on performance – until now," said Jeff Morroni, director of power management research and development at TI's Kilby Labs. "After nearly a decade in the making, TI's integrated magnetic packaging technology enables power designers to meet the defining power trend that has shaped our industry – pushing more power in smaller spaces efficiently and cost-effectively."
The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now achieve best-in-class power density and reduce temperature and radiated emissions while minimising both board space and system power losses.
TI says that these benefits are especially important in applications such as data centres, where electricity is the biggest cost factor, with some analysts predicting a 100 percent increase in demand for power by the end of the decade.
