Powertrim to target global power module market
TFA Europe and Include Industries create new semicon back-end equipment company
At the opening of PCIM Europe in Nürnberg, Germany, TFA Europe and Include Industries launched a new company called Powertrim Technologies for power module packaging.
The company builds on the heritage of TFA Europe (founded in the Netherlands in 2020 by four semiconductor tooling veterans) rebranded to Powertrim Technologies in order to expand globally. The aim is to meet the need for power modules by automotive drivetrains, new industrial power applications and the massive growth of renewable energy solutions.
Huub Claassen, co-founder and CCO, is responsible for sales and will combine this with his business development role in Boschman Advanced Packaging Technology. Include Industries founders Ilko Bosman and Daan Kersten will join him in the board as CFO and CEO respectively. An experienced CTO will be recruited shortly.
Powertrim says it has already successfully sold its first flagship product, the modular Flex Line machine, to customers in Europe, North America and Asia.
The company has a strategic collaboration with co-founder and toolmaker TSD to support Powertrim customers from initial tooling design to ramp-up for series production.
"The combination of our decades of toolmaking and semiconductor back-end experience with the successful building and scaling of high-tech equipment companies of Include Industries allows us to have a bold ambition to win this fast-growing market of power module packaging’, said Frans Derksen and Erik van Ouwerkerk, co-founders of TFA Europe.
"This new application now is still often serviced with modified traditional IC packaging equipment while the Flex Line is designed from the ground up to build individual power modules at lowest total cost and best quality. Since this is one of the final steps in the manufacturing process, a high yield is essential not to waste added value of earlier processes", added Daan Kersten and Ilko Bosman.
