CoolSiC MOSFETs now in TOLT and Thin-TOLL packages
Infineon expands portfolio of 650V CoolSiC MOSFET discretes
Infineon is expanding its portfolio of CoolSiC MOSFET discretes 650V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages. They are based on the CoolSiC Generation 2 (G2) technology, designed to offer improved figures-of-merit, reliability, and ease-of-use.
Both product families specifically target high and medium switching-mode power supplies (SMPS), including AI servers, renewable energy, EV chargers, and large home appliances.
The Thin-TOLL package has a form factor of 8x8 mm and is claimed to offer the best-in-class Thermal Cycling on Board (TCoB) capability on the market. The TOLT package is a top-side cooled (TSC) enclosure with a similar form factor to TOLL.
Both package types are designed to offer developers several benefits: Using them in AI and server power supply units (PSU), for example, reduces the thickness and length of the daughter cards and allows for a flat heat sink. When used in microinverters, 5G PSU, TV PSU and SMPS, the Thin-TOLL 8x8 package allows for a minimisation of the PCB area occupied by the power supply devices on the mainboard, while TOLT keeps the junction temperature of the devices under control, given that these applications typically use convection cooling.
The CoolSiC MOSFETs 650V G2 in ThinTOLL 8x8 and TOLT are now available in R DS(on) from 20, 40, 50 and 60 mΩ. Additionally, the TOLT variant is also available with an R DS(on) of 15 mΩ.
