Transphorm to showcase SuperGaN at PCIM 2024
Company says technology now surpasses SiC and e-mode GaN in high power systems
GaN chip firm Transphorm has announced that at PCIM 2024 (Nuremberg, June 11 to 13, 2024) it will showcase GaN's ability to outperform competitive wide bandgap technologies in higher power systems.
For example, the company says its normally-off d-mode SuperGaN platform delivers higher electron mobility resulting in lower crossover losses versus SiC—making it more a cost-effective, higher performing solution for various electric vehicle, datacentre/AI, infrastructure, renewable energy, and other broad industrial applications.
Many of these products, according to Transform, are the first publicly recognised GaN-based systems of their kind and uniquely demonstrate advantages enabled only by the SuperGaN platform. Examples include a liquid-cooled 7.5 kW PSU for mission-critical datacentre/blockchain applications; a 2.7 kW server CRPS with > 82 W/in3 power density (highest in any GaN power system available today); and 2.2 kW and 3 kW rack-mount 1U UPS .
In addition to real-world customer products, Transphorm will exhibit technological achievements such as a 5 microsecond short-circuit withstand time, a bidirectional four-quadrant switch, and a 1200 V GaN-on-Sapphire device.
On-site demonstrations will include solutions for 2- and 3-wheeler electric vehicle chargers along with customer PSUs for renewable energy systems, data centers, and more.
Also at PCIM Philip Zuk, SVP, business development and marketing will speak on the panel: GaN Wide Bandgap Design, the Future of Power on the 12th June.
