Rohm to focus on WBG at PCIM Europe
Company to focus on EcoGaN and SiC power products
At the upcoming PCIM Europe exhibition, in Nuremberg, Germany (June 11th – 13th), Rohm will have a special focus on wide bandgap (WBG) devices.
The company will launch new SiC power modules for automotive applications. In addition, it will show the conversion of its production to 8-inch SiC wafers and provide an additional outlook regarding its SiC product development.
Rohm will also be exhibiting its EcoGaN family of 150V and 650V class GaN HEMTs in several evaluation kits. The power stage IC BM3GxxMUV-LB series – including built-in 650V GaN HEMTs and gate drivers – will be extended by higher integrated PFC and QR (Quasi-Resonant) flyback converters.
The company will participate in the panel discussion: 'SiC wide bandgap design: the future of power', as well as giving a number of poster sessions focused on wide bandgap devices.
