Top-side cooling package boosts efficiency
Infineon introduces SSO10T TSC package with OptiMOS MOSFET for automotive applications
Infineon Technologies is introducing the SSO10T TSC package with OptiMOS MOSFET technology, featuring a direct top-side cooling concept.
According to the company, the package offers excellent thermal performance by eliminating heat transfer into or through the PCB of the automotive electronic control unit. Furthermore, the package enables a simple and compact double-sided PCB design.
Applications include electric power steering, power distribution, brushless DC drives, safety switches, reverse battery, and DC-DC converters.
The SSO10T TSC has a 5 x 7 mm² footprint and is based on the established industry standard SSO8, a 5 x 6 mm² robust housing. However, due to its top-side cooling, the SSO10 TSC is said to offer more than 20 percent and up to 50 percent higher performance than the standard SSO8 – depending on the thermal interface material used and the TIM thickness.
The SSO10T TSC package is JEDEC listed for open market and provides wide second source compatibility. As a result, the package can be introduced quickly and easily as the future standard for top-side cooling.
The first 40 V automotive MOSFET products with SSO10T are now available.
