+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Nexperia adds automotive diodes in CFP3-HP packages

News

Provides better heat dissipation while still maintaining small footprint size

Supporting a trend for manufacturers to replace devices in SMx-type packaging with smaller footprint devices, Nexperia is now offering 22 new planar Schottky diodes in CFP3-HP packaging. The portfolio includes 11 industrial, as well as 11 AEC-Q101 qualified products.

Device options are offered with reverse voltages VR(max) ranging from 30 V to 100 V and forward currents IF(average) between 1 A and 3 A. The exposed heatsink, which is a feature of the CFP3-HP, enables it to provide the highest level of heat dissipation (Ptot) for such a small package footprint (3.7 mm x 1.8 mm x 0.9 mm).

Using the proprietary copper clip design, these packages are said to meet the challenging demands of efficient and space-saving designs. Today, CFP packaging is used by different power diode technologies such as Nexperia’s Schottky and recovery rectifiers but can also be extended to bipolar transistors.


×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: