Nexperia adds automotive diodes in CFP3-HP packages
Provides better heat dissipation while still maintaining small footprint size
Supporting a trend for manufacturers to replace devices in SMx-type packaging with smaller footprint devices, Nexperia is now offering 22 new planar Schottky diodes in CFP3-HP packaging. The portfolio includes 11 industrial, as well as 11 AEC-Q101 qualified products.
Device options are offered with reverse voltages VR(max) ranging from 30 V to 100 V and forward currents IF(average) between 1 A and 3 A. The exposed heatsink, which is a feature of the CFP3-HP, enables it to provide the highest level of heat dissipation (Ptot) for such a small package footprint (3.7 mm x 1.8 mm x 0.9 mm).
Using the proprietary copper clip design, these packages are said to meet the challenging demands of efficient and space-saving designs. Today, CFP packaging is used by different power diode technologies such as Nexperia’s Schottky and recovery rectifiers but can also be extended to bipolar transistors.
