Siemens introduces thermal digital twin technology
Accurate reduced order thermal models of IC packages can now be shared for 3D CFD thermal analysis
Today’s electronics often have heat dissipation challenges that need to be resolved during design due to higher power density influenced by the miniaturisation of semiconductor packages and electronic systems.
To address these issues, Siemens Digital Industries Software has developed Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology to help companies accurate thermal models of chip packages to be shared in the supply chain.
Introduced in the latest updates to Simcenter Flotherm software for electronics cooling simulation, BCI-ROM technology allows a semiconductor company to generate an accurate model that can be shared with for use in down-stream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure.
The main advantages are protecting IP, enhancing supply chain collaboration and accuracy of models for steady state and transient thermal analysis to enhance design studies.
“Given electronics supply chain pressures and the growing complexity of IC packages, barriers to collaboration and thermal analysis efficiency during design must be eliminated where possible to support competitive development,” said Jean-Claude Ercolanelli, SVP, Simulation and Test Solutions, Siemens Digital Industries Software.
He added: “Our breakthrough new technology enables accurate thermal models to be shared securely within the electronics supply chain without exposing sensitive intellectual property, allowing all parties to resolve thermal issues faster and bring advanced products to market more quickly.”
