+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Silvaco joins 'GaN Valley'

News

EDA firm joins wide bandgap semiconductor innovation ecosystem in Europe

EDA firm Silvaco has joined GaN Valley, a technology hub in Europe targeting the growing industry for GaN-based electronic systems that are more efficient, smaller, lighter, and lower cost.

“Silvaco has a long history of developing TCAD technologies targeting GaN semiconductor process and device innovations with its Victory TCAD platform,” said Eric Guichard, SVP and GM of TCAD Business Unit at Silvaco. “By joining GaN Valley we will share know-how and collaborate with leading research teams within the GaN Valley members to bring new innovative solutions to the design community and help build a strong ecosystem for designing GaN-based semiconductors.”

“With rapidly evolving GaN technology and an expected $2B market by 2027, GaN is taking its place in the power semiconductor market,” said Marnix Tack, co-founder of GaN Valley and CTO of BelGaN Foundry. “GaN Valley is a new and unique ecosystem developing in Europe, currently having close to 60 members active along the GaN value chain in Europe. Through connecting and collaboration, GaN Valley will accelerate innovation and business development of a GaN-based industry in Europe and beyond.”

Power Integrations introduces offline flyback switcher
Diodes Inc launches dual-channel high side switches
Renesas Brings Industry-Leading Performance of RA8 Series MCUs to Motor Control Applications
Littelfuse Launches SM10 Series Varistor: A Breakthrough in Automotive and Electronics Surge Protection
$2.8M award to develop novel grid module
Vitesco to set up factory in Czech Republic
Silvaco joins 'GaN Valley'
Mouser opens alternative energy resource hub
Laser Thermal appoints Angstrom Scientific
Second GaN Systems founder joins QPT
Power Integrations Introduces InnoSwitch5 Offline Flyback Switcher IC
TTI Europe to stock Panjit semiconductors
Navitas and Shinry to work together on NEVs
Sinexcel to use Infineon CoolSiC MOSFETs
AOS announces double-sided cooling DFN package
Infineon and Anker open application centre
Rohm releases compact 600V MOSFETs
Webinar: Sample preparation and TEM imaging techniques for advanced power devices
Researchers develop damage-free etching for gallium oxide
Mitsubishi announces six power modules for EVs
Infineon and Wolfspeed extend SiC wafer agreement
Acquisitions in power
B-TRAN: a first for silicon-based high voltage bidirectional switching
Saving the planet with ultrafast GaN
Infineon launches next-generation flyback converter chipset
Transphorm announces 4-Lead TO-247 GaN FETs
SemiQ to show QSiC MOSFET modules at APEC 2024
Infineon CoolGaN helps shrink Omron V2X system
SweGaN boosts leadership team
Allegro MicroSystems expands gate driver portfolio
Rupert Baines appointed CEO at QPT
Mitsubishi power modules star at CES 2024

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: