AOS adds automotive MOSFETs in TOLL packaging
80V and 100V MOSFETs target 2- and 3-wheel and other light vehicles
Alpha and Omega Semiconductor (AOS) has released automotive TO-Leadless (TOLL) packaging for the company’s automotive grade 80V and 100V MOSFETs.
The company is targeting e-mobility BLDC motor and battery management applications in 2- and 3-wheel and other light vehicles.
AOS says the TOLL packaging with clip technology offers a very low package resistance and inductance, enabling improved EMI performance compared to other TOLL packages using standard wire-bonding. With the combination of low ohmic and high current capability, AOS TOLL packaging also allows designers to reduce the number of parallel MOSFETs in high current applications. This, in turn, helps to enable higher power density requirements without compromising reliability in applications where robustness and reliability are key design objectives.
The AOTL66810Q (80V) and AOTL66912Q (100V) have a 30 percent smaller footprint compared to a TO-263 (D2PAK) package. The devices are qualified to AEC-Q101, PPAP capable, and are manufactured in IATF 16949 certified facilities. AOS TOLL devices are also compatible with automated optical inspection (AOI) manufacturing requirements.
“Using the AOS Automotive TOLL package with clip technology offers significant performance improvements in a robust package. The advanced technologies in our AOTL66810Q and AOTL66912Q MOSFETs will help simplify new designs allowing them to reduce the number of devices in parallel while providing the necessary higher current capability to enable overall system cost savings,” said Peter H. Wilson, marketing senior director of MOSFET product line at AOS.