Hyundai, Kia and Infineon sign multi-year power semi deal
Infineon will build and reserve manufacturing capacity to supply SiC as well as Si power modules and chips to Hyundai/Kia until 2030
Infineon and Hyundai and Kia have signed a multi-year supply agreement for SiC and silicon power semiconductors. Infineon will build and reserve manufacturing capacity to supply SiC as well as Si power modules and chips to Hyundai/Kia until 2030.
Hyundai/Kia will support the capacity build-up and capacity reservation with financial contributions.
Heung Soo Kim, executive VP and head of Global Strategy Office (GSO) at Hyundai Motor Group said: “This partnership not only empowers Hyundai Motor and Kia to stabilise its semiconductor supply but also positions us to solidify our leadership in the global EV market, underpinned by our competitive product lineups.”
“The future car will be clean, safe and smart and semiconductors are at the heart of this transformation. As a trusted partner, we are proud to advance our long-term partnership with Hyundai/Kia,” said Peter Schiefer, president of Infineon's Automotive Division.
With the expansion of its Kulim fab, Infineon is building what it believes is the world's largest 200m SiC power fab. The Kulim facility will complement Infineon's current manufacturing capacity in Villach, Austria, and further capacity expansions in Dresden, Germany.
