MRSI introduces high force die bonder
New tool targets sintering and thermocompression for power devices
MRSI Systems, part of Swedish Mycronic Group, has launched a new high force die bonder for power devices and advanced chip packaging.
A new variant of the company's existing MRSI-705 platform, the MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top.
It is designed for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging to create strong and reliable interconnections between dies and substrates.
The MRSI-705HF can handle multiple die and process applications with auto-tool changing and laser soldering, eutectic with top and bottom heating, epoxy stamping, and dispensing in one machine.
“We are proud to announce the new MRSI-705HF high force die bonder as part of our efforts to continuously innovate and help our customers meet the changing needs of the market. It will allow us to better serve customers in power devices and advanced packaging applications,” said Irving Wang, director of marketing, MRSI Systems.