Toyo Ink introduces Nano-Ag sintering paste
Lead-free product designed to meet higher heat resistance and dissipation properties of next-generation power electronics
Toyo Ink has developed a silver (Ag) nanoparticle paste for die-attach applications that can be sintered at low temperatures under both pressureless and pressure-assisted methods.
The lead-free product has been engineered to meet the need for higher heat resistance and heat dissipation properties of electrical interconnects used in next-generation power electronics, such as SiC devices.
Sintered joints using Toyo Ink’s nano-Ag pastes are said to achieve high bond strengths of 40 MPa and higher, making it possible to sustain the high-temperature operations of high-power semiconductors used in electronic applications such as electric vehicles, radio frequency (RF) transistors and LEDs.
“We’re delighted to bring to the global marketplace an advanced silver sintering paste as an alternative solution to conventional die-attach materials,” explains Masashi Arishima, division director, Corporate R&D Division of Toyo Ink SC Holdings.
“By leveraging our original nanoparticle and paste design technologies, we succeeded in controlling the density of sintered films when applied on to copper substrates by the metal mask or dispensing printing methods. This led to the formation of bonding layers with uniform densities and without large voids in the sintered structure. As a result, high bond strengths of 40 MPa and higher were achieved. In evaluation tests of automotive electronic devices by our business partners, excellent bonding was realised by dispensing the paste at low temperatures of 230°C to 300°C under both pressureless and pressure-assisted systems.
He added: "Moreover, the sintered silver joints exhibit exceptionally high thermal conductivity of 300 W/m-k or higher. Given these results, we believe that advanced silver pastes are capable of delivering the performance and long-term package reliability demanded by today’s high-temperature and high-power applications.”
The ne nano-Ag sintering paste from Toyo Ink Group will be featured Semicon West 2023 in San Francisco, from July 11–13.
